Publications:

01. A. Gayen, N. Nallusamy, G Ezhilarasu, S. Hassan, S. Vinoth, K. Piyush, A. Goswami, B. K. Das, “A Robust and Low-cost Fiber-optic Array Attachment Solution for Silicon Photonics Chips with Large Number of Input/output Channels,” 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).

02. G Ezhilarasu, SS Iyer, “Integrated Micro-Capacitors & Micro-Inductors for Next Generation Electronics,” IEEE Nanotechnology Magazine, Feb 2024.

03. G. Ouyang, A. Hanna, S. Benedict, G. Ezhilarasu, A. Alam, R. W. Irwin, Subramanian S. Iyer, “Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022.

04. H. Sun, G. Ezhilarasu, G. Ouyang, R. Irwin, S. S. Iyer, “A Heterogeneously Integrated and Flexible Inorganic Micro-display on FlexTrate™ using Fan-Out Wafer-Level Packaging,” 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1390-1394.

05. G. Ouyang, G. Ezhilarasu, H. Sun, H. Ren, Y. T. Yang, S. S. Iyer, “A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils,” 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2266-2271.

06. G Ezhilarasu, “Flexible, Heterogeneously Integrated microLED Displays in Elastomeric Substrates Using Fan-Out Wafer-Level Packaging,” Doctoral Dissertation, University of California, Los Angeles, 2021.

07. A. Alam, M. Molter, B. Gaonkar, A. Hanna, R. Irwin, S. Benedict, G. Ezhilarasu, L. Macyszyn, M. S. Joseph, S. S. Iyer, “A high spatial resolution surface electromyography (sEMG) system using fan-out wafer-level packaging on FlexTrate™,” 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

08. G. Ezhilarasu, A. Paranjpe, J. Lee, F. Wei, S. S. Iyer, “A heterogeneously integrated, high resolution and flexible inorganic μLED display using fan-out wafer-level packaging,” 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 677-684.

09. S. Benedict, A. Nagarajan, K. Thejas, A. Alam, M. S. Illango, G. Ezhilarasu, C. Prajapati, N. Bhat, S. S. Iyer, “Heterogenous integration of MEMS gas sensor using FOWLP: Personal environment monitors,” 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

10. A. Alam, A. Hanna, R. Irwin, G. Ezhilarasu, H. Boo, Y. Hu, C. W. Wong, T. S. Fisher, S. S. Iyer, “Heterogeneous integration of a fan-out wafer-level packaging based foldable display on elastomeric substrate,” 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

11. G. Ezhilarasu, A. Hanna, A. Paranjpe, S. S. Iyer, “High Yield Precision Transfer and Assembly of GaN µLEDs Using Laser Assisted Micro Transfer Printing,” 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1470-1474.

12. A. Hanna, A. Alam, G. Ezhilarasu, T. Fukushima, S. S. Iyer, “FlexTrate A Biocompatible Flexible Electronics Platform for High Performance Applications using Fan-Out Wafer-level Packaging,” University of California Los Angeles, Los Angeles, USA, 2019.

13. G. Ezhilarasu, A. Hanna, R. Irwin, A. Alam, S. S. Iyer, “A flexible, heterogeneously integrated wireless powered system for bio-implantable applications using fan-out wafer-level packaging,” 2018 IEEE International Electron Devices Meeting (IEDM).

14. A. Hanna, A. Alam, G. Ezhilarasu, S. S. Iyer, “Fine Pitch (40μm) Integration Platform for Flexible Hybrid Electronics using Fan-Out Wafer-level Packaging,” International Symposium on Microelectronics 2018 (1), 000064-000068.

15. A. Hanna, A. Alam, T. Fukushima, S. Moran, W. Whitehead, S. C. Jangam, S. Pal, G. Ezhilarasu, R. Irwin, A. Bajwa, S. S. Iyer,“Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects,” 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511.

16. T. Fukushima, A. Alam, Z. Wan, S. C. Jangam, S. Pal, G. Ezhilarasu, A. Bajwa, S. S. Iyer, “FlexTrateTM - Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP,” 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

17. Z. Li, G. Ezhilarasu, et al., “Indirect Band Gap Emission by Hot Electron Injection in Metal/MoS2 and Metal/WSe2 Heterojunctions,” Nano letters 15 (6), 3977-3982.

Posters & Presentations:

01. G. Ezhilarasu, A. Hanna, S. S. Iyer, “Wireless Power Transfer system on FlexTrateTM for bio-medical applications,” FLEXCON 2019 (Poster), Monterey, CA, USA.

02. G. Ezhilarasu, A. Hanna, A. Paranjpe, S. S. Iyer, “High Yield Precision Transfer and Assembly of GaN µLEDs Using Laser Assisted Micro Transfer Printing,” 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA.

03. G. Ezhilarasu, A. Hanna, R. Irwin, A. Alam, S. S. Iyer, “A flexible, heterogeneously integrated wireless powered system for bio-implantable applications using fan-out wafer-level packaging,” presented at the 2018 IEEE International Electron Devices Meeting (IEDM), San Francisco, USA.

04. Z. Li, G. Ezhilarasu, I. Chatzakis, R. Dhall, C. C. Chen, S. B. Cronin, “Indirect Band Gap Emission by Hot Electron Injection in Metal/MoS2 and Metal/WSe2 Heterojunctions,” APS March Meeting 2016, March 14–18, 2016; Baltimore, Maryland.

05. G. Ezhilarasu, “Fan-Out Wafer-Level Packaging for Flexible Medical Devices”, Flex 2025 Workshop, ASU/Mayo Clinic Health Futures Center, Phoenix, AZ, USA.